IC internals are one of the last unexplored frontiers of hardware hacking. This talk will present methods to safely expose (deencapsulate) IC dies, techniques for imaging them, as well as why the hell someone would actually want to do that. Modern ICs are typically packaged in extremely robust epoxy potting, designed to resist both physical and chemical attack. Typical techniques for removing this packaging involve the use of extremely hazardous chemicals, dangerous procedures, a decent risk of death or disfigurement, and a high risk of ending up on a government watch list. This presentation will cover a reasonable safe, affordable, method to deencapsulate an IC die, which most should be able to do at home, without badly annoying housemates/SOs.