This four hour tutorial explains the design concepts for implementing physical security for FIPS 140-2 cryptographic modules at security levels 2, 3 and 4. Design of physical security for FIPS 140-2 can be a complex process, even at levels 2 and 3. This tutorial will detail designs and methods that will meet FIPS 140-2 requirements. At levels 2 and 3, basic designs will be presented for both encapsulated (potted) designs (for card and token type modules) and openable case approaches. Thermal and ventilation issues will be discussed, as well as seals, locks and tamper evident labels used to meet requirements. At level 4, a complete design will be presented showing all sensors, tamper detection and response mechanisms. Power consumption, back powering, zeroization and micro-power circuitry will be detailed. Strengths and weakness of the various techniques will be discussed with respect to size, power dissipation, maintenance, reliability and environment. Manufacturing and manufacturability will be discussed at all levels.